Illustrated Intel Centrino Duo technology guide

In January 2006, Intel introduced the revolutionary Intel Centrino Duo Mobile Technology platform (formerly codenamed Napa), the third generation of the company’s Centrino mobile processor technology bundle. Facilitating a whole new generation of thin and light notebook PCs, the following three next generation components will together enable future Centrino Duo laptops to surpass both the performance and battery life of previous generation Centrino platforms: Intel Core Duo Processor Mobile Intel 945 Express Chipset Family Intel PRO/Wireless 3945ABG Network Connection. The Intel Core Duo processor (previously codenamed Yonah) is Intel’s first mobile dual-core processor built on the company’s next generation 65 nm process technology. This has enabled a pair of Yonah cores to be fit onto a die only slightly larger than the previous Dothan-cored Pentium M (90mm2 compared to 84mm2 for the older part). The relatively small increase in die size and total transistor count (up around 11 million to approaching 152 million) is largely explained by the fact that most of the area of the die is taken up by the same 2MB of Level 2 cache. In addition to the new mobile dual-core architecture, the Intel Core Processor includes several innovative features. These include a number of changes which together eliminate limitations that have restricted the Pentium M’s multimedia performance relative to that of NetBurst architecture-based chips. Referred to a Digital Media Boost, these include instruction optimisations and performance enhancements for existing Streaming SIMD Extensions 2 (SSE2), 13 new Streaming SIMD Extensions 3 (SSE3) instructions and enhancements to floating point instruction decoding performance that will allow multiple SSE instructions to be handled in parallel. Another new feature...

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